Jinan Lingxiu Laser Equipment Co.,Ltd.
Laser cutting: The latest mainstream laser cutting equipment is mainly fiber laser cutting machines and CO2 laser cutting machines. At present, the CO2 laser cutter is mainly used for cutting thick plates, but it can cut non-metallic materials. The first two are mainly used for the cutting of plates, and the latter is used for the cutting of thick plates and non-metallic cutting (non-metallic materials are not compared here). Fiber laser cutting machine has the characteristics of fast cutting speed, good cutting quality, and low processing cost.
Wire cutting: Wire cutting can only cut conductive materials, which limits its application and requires cooling fluid during the cutting process. Therefore, some non-metallic materials such as leather are not good enough, and materials that are afraid of water and cutting fluid pollution cannot achieve straight cutting. The advantage is that the thick plate can be cut at one time, but the cutting edge will be very rough. Current wire cutting can be divided into fast routing and slow routing according to the type of wire used. The fast-moving thread can be cut multiple times, and the slow-moving thread can only be cut once. Of course, copper wire is much cheaper than molybdenum wire. Another fast-moving device is much cheaper than slow-moving devices, and the price is about five to six times that of fast-moving devices.
Laser cutting is achieved by using high-temperature molten cutting materials produced by high-energy-density laser beam irradiation. The metal material to be cut should not be too thick, otherwise, the area affected by the heat will be too large, or even impossible to cut. The laser cutter has a wide range of applications. It can cut most metals and is not limited by shape. The disadvantage is that it only cuts plates.
Molybdenum wire for wire cutting, high-temperature cutting materials produced by electrification are cut, usually used as a mold. The area affected by heat is relatively uniform and small. It can cut thick plates, but the cutting speed is slow, only conductive materials are cut, and the application is small. Because there are consumables, the processing cost is higher than laser cutting.
Advantages: The two can basically complement each other, but with the needs of industrial development, the increasing demand of large-scale production and processing enterprises means higher requirements for efficiency, so high-speed, high-quality, low-cost laser cutting technology is more suitable for the needs of modern production, and gradually loses market competitiveness.
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